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51305072-300 | Honeywell | CLCN-B CE Comp. I/O Card

51305072-300 | Honeywell | CLCN-B CE Comp. I/O Card

  • Manufacturer: Honeywell

  • Product No.: 51305072-300

  • Condition:in Stock

  • Product Type: CLCN-B CE Comp. I/O Card

  • Product Origin: USA

  • Payment:T/T, Western Union

  • Weight: 160g

  • Shipping port: Shanghai/Yiwu/Shenzhen

  • Warranty: 12 months

Honeywell CLCN-B 51305072-300 CE Comp. I/O Card

The Honeywell 51305072-300 CLCN-B, also cataloged as the CLCN-B communication I/O card, operates as a paddle board for Local Control Network (LCN) "B" channel interfacing within Honeywell TDC 3000 and Experion PKS migration systems.

Hardware Specifications

Parameter Specification
Model 51305072-300
Brand Honeywell
Origin USA
Weight ~0.16 kg
Dimensions 3.0 cm x 13.5 cm x 23.7 cm
Operating Temp 0 to +60 deg C
Power Consumption 12–24 VDC input, nominal 24 VDC
Core Performance Dual-node LCN "B" path, CE compliant, 1500 VDC isolation

Backplane Bus Communication and Redundant Path Operation

The CLCN-B card provides deterministic backplane bus communication velocity across the LCN "B" channel. It is designed to operate in paired redundancy with the CLCN-A (51305072-200), forming dual-path A/B communication. BNC tee connectors allow seamless bus insertion or removal without disrupting the primary network. Electrical isolation up to 1500 VDC protects against industrial interference and fault conditions.

Frequently Asked Questions

Q: Can the CLCN-B card be removed without interrupting the LCN network? A: Yes, BNC tee connectors allow disconnection of a single node without affecting the main bus.

Q: How does redundancy work with CLCN-A and CLCN-B? A: The cards operate in paired A/B configuration, providing dual-path communication for fault tolerance.

Q: What isolation level is provided? A: The module supports up to 1500 VDC isolation between signal paths and chassis ground.

Field Installation Guidelines

  • Insert the card into the designated dual-node chassis slot with full connector engagement.
  • Ensure BNC tee connectors are properly seated and shielded to prevent signal reflection.
  • Maintain grounding continuity for shielding layers to minimize electromagnetic interference.
  • Route communication cabling separately from high-voltage conductors.
  • Verify redundant A/B path integrity during commissioning before enabling system operation.
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