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Honeywell 51400667-100 Enhanced LCN Interface Board
Honeywell 51400667-100 Enhanced LCN Interface Board
Manufacturer: Honeywell
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Product No.: 51400667-100
Condition:in Stock
Product Type: Enhanced LCN Interface Board
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Product Origin: USA
Payment:T/T, Western Union
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Weight: 1000g
Shipping port: Shanghai/Yiwu/Shenzhen
Warranty: 12 months
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Honeywell 51400667-100 Enhanced LCN Interface Board
The Honeywell 51400667-100 Enhanced LCN Interface Board is a communication interface module used within Honeywell TDC 2000 and TDC 3000 Distributed Control Systems. The board provides the connection between processor modules and the Local Control Network (LCN), handling communication and data routing functions that enable coordinated operation across the control system architecture.
Technical Specifications
| Parameter | Specification |
|---|---|
| Model | 51400667-100 |
| Brand | Honeywell |
| Product Type | Enhanced LCN Interface Board |
| System Compatibility | TDC 2000, TDC 3000 DCS |
| Compatible Processors | HPK2-2, HPK2-3, HMPU |
| Primary Function | Processor-to-LCN communication and data routing |
| Installation Location | Standard Honeywell LCN card cage racks |
| Dimensions | Standard industrial DCS rack card size |
| Weight | Approx. 0.84-0.91 kg (1.85-2.0 lb) |
| Cooling Method | Forced-air rack ventilation |
| Operating Temperature | 0 deg C to 60 deg C |
| Storage Temperature | -40 deg C to +85 deg C |
| Relative Humidity | 5% to 95%, non-condensing |
LCN Communication Function
The board serves as the communication interface between Honeywell processor modules and the Local Control Network. It facilitates the transfer of operational data, control information, and system messages required for distributed processing within TDC-based control systems.
By managing communications between processor resources and the LCN infrastructure, the module supports coordinated interaction among controllers, operator stations, application nodes, and other networked system components.
Processor Compatibility
The 51400667-100 is designed for use with specific Honeywell processor platforms, including:
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HPK2-2 processor modules
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HPK2-3 processor modules
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HMPU processor modules
Compatibility with the installed processor type should be confirmed when replacing or upgrading existing hardware to ensure proper communication within the TDC system.
Installation and System Integration
The board is designed for installation in standard Honeywell LCN card cage racks. As part of the LCN infrastructure, it occupies a dedicated rack position and interfaces directly with supported processor assemblies.
Because communication architecture is critical to system operation, replacement modules should match the original part number and system configuration requirements.
Environmental Characteristics
The module is intended for installation in controlled industrial equipment cabinets using standard forced-air rack ventilation. Environmental specifications support operation across a temperature range of 0 deg C to 60 deg C and storage temperatures from -40 deg C to +85 deg C.
The allowable humidity range of 5% to 95% non-condensing supports operation in typical industrial control room and equipment cabinet environments.
Role in TDC Systems
Within Honeywell TDC architectures, the Enhanced LCN Interface Board functions as a network communication component rather than a control processor. It provides the communication path required for processor modules to exchange information with the Local Control Network and participate in system-wide control, monitoring, and data management activities.
Its position within the communication infrastructure makes proper module selection and compatibility verification important during maintenance and modernization projects.
Frequently Asked Questions
Q: What is the primary function of the 51400667-100 board?
A: The board manages communication and data routing between compatible processor modules and the Honeywell Local Control Network (LCN).
Q: Which Honeywell systems support this interface board?
A: The module is designed for Honeywell TDC 2000 and TDC 3000 Distributed Control Systems.
Q: Which processor modules can be used with the 51400667-100?
A: Documented compatible processors include HPK2-2, HPK2-3, and HMPU processor modules.
Q: Does the module require special cooling?
A: No dedicated cooling hardware is specified. The board is designed to operate with standard forced-air ventilation provided by the DCS rack system.
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